【SBT】パッケージ基板設計DFM エンジニア

Job Description

The role involves optimizing packaging substrate design and manufacturing efficiency. Responsibilities include managing substrate design rules, leading supplier DFM reviews, collaborating with simulation teams for thermomechanical and electrical simulations, and supporting substrate development engineers in supplier meetings.

Key Responsibilities

• Manage substrate design rules for internal and external guidance.
• Lead supplier DFM reviews to identify gaps and optimize yield and reliability.
• Collaborate with simulation teams for thermomechanical and electrical simulations.
• Drive DFM efficiency improvements and develop new methodologies.

Qualifications

• 5+ years of experience in the packaging substrate industry.
• Familiarity with substrate design rules and tools.
• Knowledge of substrate design and its correlation to physical and electrical performance.
• Bachelor's, Master's, or Ph.D. in Materials Science, Mechanical or Chemical Engineering, or related fields.
• Proficiency in Japanese (N2 level) and English (TOEIC score of 650 or above).

Employment Details

Full-time position with no fixed contract period. The role is based in Tsukuba, Ibaraki, Japan, with a standard work schedule of 9:00 to 18:00. Remote work is generally not available due to the nature of research and development activities.