Dry Etch Process Engineer

Minimum Qualifications

 Ph.D. in Materials Science, Chemical Engineering, Chemistry or Physics with 6 years

of relevant work experience; or

 M.S. with 8+ years of relevant work experience; or

 B.S. with 12+ years of relevant work experience.

Preferred Qualifications

 In depth understanding of Plasma Physics, Reactive Ion Etching (RIE), Atomic Layer

Etching (ALE), Inductively Coupled Plasma (ICP), Capacitively Coupled Plasma (CCP).

 Familiarity with working in a laboratory and on semiconductor equipment with

experience in surface preparation and analytical techniques.

 Experience in surface preparation and analytical techniques.

 Interest in advanced technology and an on-going desire to learn.

 In-depth understanding and working knowledge of Statistical Process Control (SPC)

and/or Design of Experiments (DOE); experience with statistical tools (JMP,

Minitab, etc.)

 Strong organizational skills and demonstrated ability to manage multiple tasks

simultaneously and ability to react to shifting priorities to meet business needs and

deadlines.

 Excellent people skills with demonstrated ability to work effectively and efficiently

with diverse teams, semiconductor customers, internal and external partners.

 Experience working in a collaborative and matrixed environment

 Demonstrated ability to manage team of process engineers handling development

projects and supporting semiconductor customers