
Process Engineer
Lam Research
Required Skills:
Process Engineering
Depositions
Minimum Qualifications
Ph.D. in Materials Science, Chemical Engineering, Chemistry or Physics
with 5 years of relevant work experience; or
M.S. with 8+ years of relevant work experience; or
B.S. with 12+ years of relevant work experience.
Preferred Qualifications
In-depth understanding and working knowledge of Semiconductor processes
such as Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD),
Plasma Enhanced Chemical Vapor Deposition (PECVD), or Physical Vapor
Deposition (PVD)
Background in Plasma Physics, Reactive Ion Etching (RIE), Atomic Layer
Etching (ALE), Inductively Coupled Plasma (ICP), Capacitively Coupled
Plasma (CCP).
Familiarity with working in a laboratory and on semiconductor equipment
with experience in surface preparation and analytical techniques.
Experience in surface preparation and analytical techniques.
Interest in advanced technology and an on-going desire to learn.
In-depth understanding and working knowledge of Statistical Process
Control (SPC) and/or Design of Experiments (DOE); experience with
statistical tools (JMP, Minitab, etc.)
Strong organizational skills and demonstrated ability to manage multiple
tasks simultaneously and ability to react to shifting priorities to meet
business needs and deadlines.
Excellent people skills with demonstrated ability to work effectively and
efficiently with diverse teams, semiconductor customers, internal and
external partners.
Experience working in a collaborative and matrixed environment
Demonstrated ability to manage team of process engineers handling
development projects and supporting semiconductor customers
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