
PCB/Substrate Layout Design Engineer
Global-Talent-Exchange
Required Skills:
Cadence Allegro Pcb Designer
Analog Electronics
Digital Electronics
HDI
MySAP
PCB development
Cadence CIS
Cadence Allegro
analog electronics
digital electronics
HDI
MSAP
DFM best practices
IPC Certification
PCB/Substrate Layout Design Engineer
Location: Germany, Nuremberg
Contract or Permanent position available
Lead highly complex PCB/Substrate Layout designs for complex RF and electro optical designs. Responsible for ensuring technical milestones are achieved. Ensures specification requirements input and design outputs align.
What will you do?
- Execution implementation of PCB layouts, including the creation of component symbols and footprints
- Provide feedback and guidance on substrate technology and processes
- Perform, review and implement design for manufacturing analysis and reports
- Layout and build files including PCB design, ceramic substrate design, organic substrate design, and complex multi-layer packaging design
- Work with external PCB suppliers/manufacturers and provide input to their product roadmaps
- Communicates technical aspects of a project effectively to management
- May perform other duties and responsibilities as assigned
Experience:
- 8+ years’ experience in embedded hardware design or other key competency is required
- Experience with PCB development and understanding of PCB constraints is required
- Experience with Cadence CIS and Cadence Allegro is required
- Understanding of analog and digital electronics is required
Knowledge, Skills, Abilities:
- Experience with HDI (High Density Interconnect) and MSAP is an asset
- Familiarity with PCB fabrication processes, DFM best practices and IPC Certification (CID, CID+) are all a plus
- Influence others and share best practices
- Effectively communicate with good understanding of English
- Assess a project and articulate risk while developing project milestones
- Mentor less experienced designers
About Company

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